中芯国际总部

日期 2016-2017
位置 上海,中国
面积 450000 m2
阶段 Concept design, detailed design supervision
投资者 SMSC
合作 SUD Architectes, EDRI Shanghai

Micro-state in macro-scale
Design intent was to create external envelope of SMSC office building as an abstract representation of SMSC manufactured product. Front facade is grounded on the idea of transmission of the semiconductor wafer’s micro-scale look to the macro-scale of the building. The pattern is strongly inspired by the characteristics of photoresist pattern on the silicon substrate. Integration of macro and micro scale on the facade guides visitors into semiconductor industry.

Through the diverse density of its vertical mullions there would be a peek out of both raw volume of the building and soft greenery of the leisure areas. It would express the rigorous, engineering meaning of the products made by the company and the subtle, artistic side of the people who are responsible for their creation. Synergy of nature, art and technology.

Following sustainable development principles, another major goal was to reduce impact on the west facade  while not obstructing the view from office units. As the main elevation is both most sun exposed and most office used, the proposed external vertical louvers system would reduce the heat accumulated in the building.

Micro technology, energy efficiency, integration with nature, sustainability, all this facade features tells the company story, representing the future of semiconductor industry.